- Apple to use TSMC’s advanced WMCM and SOPU packaging for A20 and server plants with monthly production to get 10,000 gofrets in 2026 WCCFTECH
- In the advanced A20 chip packaging of iPhone 18 in TSMC Macrumors
- TSMC advanced packaging wins traction with Apple, NVIDIA orders Numerical
- iPhone 18 Pro can go to full genius mode with this secret chip Tech FoneArena
- Apple iPhone 18 Pro Max and folding iPhone, TSMC’s 2nm process, get the first bottoms in the A20 chip Techspot
